International Research Journal of Innovations in Engineering and Technology - IRJIET International Open Access, Monthly, Peer Reviewed, Reputed Journal ISSN (online): 2581-3048

Impact Factor (2025): 6.9

DOI Prefix: 10.47001/IRJIET

Experimental Study of Thermal Properties of Aluminum Matrix Composites Inserted Multiwalled Carbon Nanotubes for Heat Sink Applications

Abstract

The heat sink is an important component in laptop computers as it dissipates the heat generated by the system. The efficiency, cost and overall size of the system can be affected by the heat sink device. Four selection criteria; thermal conductivity, coefficient of thermal expansion, density and minimal cost to choose a laptop computer cooling material The ideal heat sink material exhibits high thermal conductivity, low coefficient of thermal expansion, low density and low cost. In this study, we investigated the thermal properties of aluminum matrix composites reinforced with 0-10 wt% copper-coated Multiwalled carbon nanotubes (MWNTs) produced by liquid state processing. Composites with the addition of <10 wt.% MWNTs have higher thermal conductivity than pure aluminum produced by the same liquid state processing. The MWNTs/Al composite exhibited a maximum thermal conductivity of 199 W/m/K at 5 wt.% MWNTs. The increase in thermal conductivity is supported by the measured micro hardness. The MWNTs/Al composites exhibited a maximum microhardness of 90 HV also at 5 wt.% MWNTs. The contribution of carbon nanotubes to the thermal conductivity of the composite was demonstrated by theoretical analysis. The results showed that MWNT-reinforced aluminum matrix composite is a potential material for high thermal conductivity applications, such as heat sink applications.

Country : Indonesia

1 I Dewa Made Pancarana2 I Nyoman Budiartana

  1. Mechanical Engineering Department, Bali State Polytechnic, Bali, Indonesia.
  2. Mechanical Engineering Department, Bali State Polytechnic, Bali, Indonesia.

IRJIET, Volume 6, Issue 9, September 2022 pp. 100-108

doi.org/10.47001/IRJIET/2022.609016

Full Paper
Download

References

  1. Ashby, M.F., Brechet, Y.J.M., Cebon, D., & Salvo, L., “Selection strategies for materials and processes”, Materials and Design, vol. 35, no. 1, pp. 51-67, 2004.
  2. Ray, P.P., “Surface Mount Technology: Principles and Practice”. 2nd ed. Massachusetts USA: Kluwer Academic. pp. 3-723, 2002.
  3. Braithwaite, N., & Weaver, G., “Materials in action series: Electronic Materials”, London: Butterworth Scientific Ltd. pp. 11-82, 1990.
  4. Reddy, P. G., & Gupta, N., “Material Selection for Microelectronic Heat Sink: An Application  of the Ashby Approach”, Materials  and  Design, vol. 31, no. 1, pp. 113-117, 2010.
  5. Hartle, R. “How heat sink works. Available”, http://computer.howstuffworks.com/heat­sink.htm/printable. Last accessed 27th January 2011.
  6. Keller, K. P., “Cast heat sink design advantages”, IEEE intersociety conference on thermal phenomena, vol. 1, no. 1, pp. 112-117, 1998.
  7. Gallagher, Shearer, B., & Matijasevic, G., “Materials  Selection  Issues   for   High Operating Temperature (HOT) Electronic Packaging”, lEE. vol. 1, no. 1, pp. 180-189, 1998.
  8. Dogruoz, M. B., & Arik, M.. “On the conduction and convection heat transfer from lightweight advanced heat sinks”, IEEE transactions on components and packaging technologies, vol. 1, no.  I,  pp. 1521-1528, 2010.
  9. Dogruoz, M.B.,  & Arik, M., “An  investigation on the  conduction  and  convection   heat transfer from advanced heat sinks”,  IEEE.  vol. 1, no. 1, pp. 367-372, 2008.
  10. Kandasamy, R., Xiang-Qi, W., & Mujumdar, A.S., “Transient cooling of electronics using  phase change  material   (PCM)-based heat    sinks”, Applied  Thermal  Engineering, vol. 28, no. I, pp. 1024-1057, 2008.
  11. Dai, H, “Carbon nanotubes: opportunities and challenges”, Surface Science, vol. 500, Issues 1–3,  pp. 218-241, 2002, https://doi.org/10.1016/S0039-6028(01)01558-8
  12. Yoshida, Y., “High-temperature shrinkage of single-walled carbon nanotube bundles up to 1600 K”, Journal of Applied Physics, vol. 87, no. 7, pp. 3338-3341, 2000.
  13. Philip, G., Collins, M. S., Arnold & Avouris, P., “Engineering Carbon Nanotubes and Nanotube Circuits Using Electrical Breakdown”, Science, vol .292, issue 5517 , pp. 706-709, 2001 , doi : 10.1126/science.1058782
  14. Berber, S., Kwon ,Y.K., & Tomanek, D., “Unusually high thermal conductivity of carbon nanotubes”, Phys Rev Lett, vol. 84, pp. 4613–4616., 2000.
  15. Kim, P., Shi, L., Majumdar, A., & McEuen, P.L, “Thermal transport measurements of individual multiwalled nanotubes”, Phys Rev Lett, vol. 87, no. 21, pp. 5502., 2001.
  16. Bakshi , S.R., Patel, R.R., &Agarwal, A., “Thermal conductivity of carbon nanotube reinforced aluminum composites: a multi-scale study using object oriented finite element method”, Comput Mater Sci, vol.50, pp. 419–28,  2010
  17. Yamanaka, S., Kadokura, H., Kawasaki, A., Sakamoto, H., Mekuchi, Y., Kuno, M., et al. “Fabrication and thermal evaluation of carbon nanotube/aluminium composite by spark plasma sintering method”,  J Jpn Soc Powder Powder Metall, vol. 53, no.12, pp. 965–970, 2006
  18. Kim, C., Lim, B., Kim, B., Shim, U., Oh, S., Sung, B., et al., “Strengthening of copper matrix composites by nickel-coated single-walled carbon nanotube reinforcements”. Synth Met., vol.159, pp. 424–429, 2009.
  19. Chu, K., Wu, Q.Y., Jia, C.C., Liang, X.B., Nie, J.H., Tian, W.H., et al. “Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications”, Compos Sci Technol, vol. 70, pp. 298–304,  2010.
  20. Cohen, R. & Meek, R., “The chemistry of palladium—tin colloid sensitizing processes”, J Colloid Interface Sci., vol. 55, pp.156–162, 1976.
  21. Shacham-Diamand, Y., Sverdlov, Y., Friedberg, S., & Yaverboim, A., “Electroless plating and printing technologies, in nanomaterials for 2D and 3D printing”. In: S. Magdassi and A. Kamyshny (eds) Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, Germany. 2017,  https:// doi.org/10.1002/9783527685790.ch3
  22. Birkeland, P.W., “Soil And Geomorphology”, Oxford, University Press New York, 1984.
  23. Dowling, N., "Mechanical Behavior of Materials: Engineering Methods for Deformation, Fracture, and Fatigue", Prince hall, 1999.
  24. Garnier, V., Fantozzi, G., Nguyen, D., Dubois, J. & Thollet, G., “Influence of SiC whisker Morphology and Nature of SiC / Al2O3 Interface on Thermo Mechanical Properties of SiC Reinforced Al2O3 Composites”, Journal of the European Ceramic Society, vol. 25, issues. 15, pp. 3485-3493. 2005. doi : 10.1016/j. jeurceramsoc.2004.09.026
  25. Agarwal, A., Bakshi, S.R., and  Lahiri, D., “Processing techniques: Carbon nanotubes reinforced metal matrix composites”, CRC Press-Taylor & Francis, Boca Raton, Florida, pp. 30–33, 2011.

Copyright @ 2026-2017 IRJIET. All Right Reserved.

Developed by Byzero Technologies